Surface termination and hydrogen bubble adhesion on Si(100) surfaces during anisotropic dissolution in aqueous KOH

W. Haiss, P. Raisch, L. Bitsch, R.J. Nichols, X. Xia, J.J. Kelly, D.J. Schiffrin

Research output: Contribution to journal › Article › Academic › peer-review

Original language	Undefined/Unknown
Pages (from-to)	1-12
Number of pages	12
Journal	Journal of Electroanalytical Chemistry
Volume	597
Publication status	Published - 2006

Access to Document

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title = "Surface termination and hydrogen bubble adhesion on Si(100) surfaces during anisotropic dissolution in aqueous KOH",

author = "W. Haiss and P. Raisch and L. Bitsch and R.J. Nichols and X. Xia and J.J. Kelly and D.J. Schiffrin",

year = "2006",

language = "Undefined/Unknown",

volume = "597",

pages = "1--12",

journal = "Journal of Electroanalytical Chemistry",

issn = "0022-0728",

}

TY - JOUR

T1 - Surface termination and hydrogen bubble adhesion on Si(100) surfaces during anisotropic dissolution in aqueous KOH

AU - Haiss, W.

AU - Raisch, P.

AU - Bitsch, L.

AU - Nichols, R.J.

AU - Xia, X.

AU - Kelly, J.J.

AU - Schiffrin, D.J.

PY - 2006

Y1 - 2006

M3 - Article

SN - 0022-0728

VL - 597

SP - 1

EP - 12

JO - Journal of Electroanalytical Chemistry

JF - Journal of Electroanalytical Chemistry

ER -