Integrated diffusion-recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials

E. Kunnen*, G. T. Barkema, C. Maes, D. Shamiryan, A. Urbanowicz, H. Struyf, M. R. Baklanov

*Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

Abstract

This work proposes an extended model that describes the propagation of damage in porous low-k material exposed to a plasma. Recent work has indicated that recombination and diffusion play a more dominant role than VUV light [1-5] in oxygen plasma induced damage. Especially at low depths, the radical concentration is determined by the number of radicals that disappear back into the plasma while the final depth of damage is defined by recombination of oxygen atoms. A logarithmic equation has been proposed to describe the behavior as a function of time. In this work this equation is extended to take diffusion into account, next to recombination. The results are in agreement with experimental data and one-dimensional random walk theory calculations. (C) 2010 Elsevier B.V. All rights reserved.

Original languageEnglish
Pages (from-to)631-634
Number of pages4
JournalMicroelectronic Engineering
Volume88
Issue number5
DOIs
Publication statusPublished - May 2011
EventInternational Workshop on Materials for Advanced Metallization (MAM 2010) - Mechelen, Belgium
Duration: 7 Mar 201010 Mar 2010

Keywords

  • Plasma damage
  • Recombination
  • Diffusion
  • Low-k
  • Porous

Fingerprint

Dive into the research topics of 'Integrated diffusion-recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials'. Together they form a unique fingerprint.

Cite this